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AirspaceCompute Ruggedized Airborne Architecture

DO-254 FPGA/SoC Accelerator, ECC Memory Enclaves, and Conduction-Cooled Chassis

Central System: Airborne Edge Mission Computer - DO-254 DAL A Silicon Core

Aviation Architecture Nodes

• Multi-Sensor PCIe 5.0 DMA Ingress
• Radiation-Hardened ECC Memory Enclave
• FPGA Deterministic Vision Pipeline
• ARINC 653 Hardware Partition MPU
• Passively Conduction-Cooled Chassis

Architectural Layers & Protocol Stacks

• Physical Ruggedization & Thermal Management (RTCA DO-160G Section 4-8 (Temperature, Shock, Vibration, Altitude up to 55,000 ft)): Sealed aluminum-alloy chassis operating without cooling fans from -55°C to +85°C and withstanding 20G shock and extreme vibration profiles under RTCA DO-160G.
• Radiation Hardening & Single-Event Upset Protection (TMR Silicon Logic / Error Correcting Code (ECC) / Scrubbing Controllers): Triple-Modular Redundant (TMR) flip-flop registers, hardware parity scrubbers, and ECC memory preventing single-event upsets caused by high-altitude cosmic rays.
• Heterogeneous Hardware Acceleration (AMD Versal AI Core / Xilinx UltraScale+ / ARM Cortex-R8 / OpenCL for Avionics): Combining multicore ARM Cortex-R8 real-time cores for flight control with high-throughput FPGA fabric for zero-latency 4K optical and FMCW radar beamforming.
• Deterministic Hardware Memory Isolation (Hardware MPU Enclaves / CAST-32A & AC 20-193 Multicore Interference Compliance): Memory Protection Units (MPU) enforcing rigid spatial boundaries between unverified vision neural networks and DO-178C DAL A primary flight guidance software.

Flight Telemetry Metrics: 120 TOPS (Airborne AI Inference Throughput) | < 100 µs (Worst-Case DMA Interrupt Latency) | 55,000 ft (Operational Altitude Ceiling) | DAL A (DO-254 Hardware Certification Level)